New Ultrus™ laser system harnesses ultrafast, high-pulse-rate laser technology for precise, accurate grooving plus lower cost of ownership
The UltrusTM system combines ultrafast high-pulse-rate lasers and ESI's proprietary beam positioning technology to provide a high-throughput, high-accuracy grooving solution that addresses the challenges associated with processing thinner and more fragile materials. Since the UltrusTM system allows for higher die break strength (DBS) and a smaller heat affected zone (HAZ), semiconductor manufacturers can now process newer thin wafers efficiently at the higher level of accuracy required and low-k materials—as well as current materials—without risking damage to the underlying devices.
"For semiconductor manufacturers, just keeping pace with Moore's Law
requires constant innovation across their processing operations," said
Although laser-based platforms have become essential for cost-effective wafer processing, the adoption of more fragile materials has presented semiconductor manufacturers with processing challenges related to maintaining high throughput at high accuracy while minimizing the risk of damage to the material—and thereby decreasing yields. Using ultrafast, high-pulse-rate laser technology to precisely remove metal layers and fragile materials allows for higher die break strength and smaller heat affected zones, leading to higher yields and a lower total cost of ownership.
The UltrusTM laser system is available now worldwide. For more information go to: http://www.esi.com/Products/Semiconductor/LaserScribingGrooving/Ultrus.aspx.
ESI's integrated solutions allow industrial designers and process
engineers to control the power of laser light to transform materials in
ways that differentiate their consumer electronics, wearable devices,
semiconductor circuits and high-precision components for market
advantage. ESI's laser-based manufacturing solutions feature the
micro-machining industry's highest precision and speed, and target the
lowest total cost of ownership. ESI is headquartered in
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