ESI Unveils Newest Addition to Its PCB Via Drilling Product Portfolio
New nViantTM CO2-Laser-Based HDI Processing System Delivers the Precision, Accuracy and Throughput Required for High Volume Manufacturing of PCB's
A CO2 laser-based microvia drilling system, nViant™ combines excellent quality via formation with industry-leading accuracy on a robust platform that delivers high throughput at a competitive price point. The nViant™ system was designed and built for manufacturers of HDI boards, used in smartphones, wearables and other mobile devices. HDI components are also used in industrial and automotive markets.
High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. The nViant™ system enables HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. The nViant™ system joins ESI's long history of products targeted for the production floor and reinforces ESI's focus and experience on speed, quality and accuracy.
"nViant™ leverages our expertise in laser processing and our proven track record of success in laser-based systems—especially in the flexible PCB manufacturing segment, where ESI is the clear market leader—and applies it to the HDI manufacturing segment," said
For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership. ESI's nViant™ system extends this advantage with robust platform construction that allows for 24/7 operation. Support is provided through ESI's professional service organization.
The launch of nViant™ is taking place in conjunction with the 2015 International Printed Circuit & APEX South China Fair (2015 HKPCA & IPC Show)
The nViant™ HDI CO2 laser microvia drilling system is available for order beginning mid-December, worldwide. For more information go to: http://www.esi.com/Products/ViaDrilling/High-DensityInterconnect/nViant.aspx
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Rob GoodmanAccount Manager, McKenzie Worldwiderobg@mckenzieworldwide.com 503-380-2441 ESI Brian Smith 503-672-5760 firstname.lastname@example.org
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