ESI Expands Market-Leading Family of Laser Processing Platforms For PCB Fabricators
The RedStone™ system not only provides FPC processors new to laser processing with a low cost-of-ownership entry point, but also enables established FPC processors to optimize production around specific through-hole drilling and routing applications.
The LodeStone™ system addresses the high-reliability routing requirements of processors focused on industries such as medical device manufacturing, where requirements demand laser processing with minimal residual carbonization and smaller heat-affected zones. It utilizes an ESI-developed femtosecond-class green laser—the first to be offered in the FPC manufacturing segment—and incorporates ESI's proprietary rod fiber technology.
These new products extend the breadth of ESI's market-leading portfolio of laser-based PCB manufacturing solutions. A portfolio which already included the industry's most popular line of flex processing systems, a CO2-laser-based processing system for affordable HDI PCB manufacturing, and a high-volume low cost-of-ownership solution for IC packaging.
Early market adoption of the RedStone and LodeStone systems has been promising, with initial-system orders placed with
"ESI's leadership in this segment draws on our decades of accumulated expertise in laser/material interaction and our ongoing partnership with customers to help them optimize their production capabilities," stated
RedStone and LodeStone systems are available through ESI directly and through ESI channel partners.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in
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