ESI Advances HDI Via Drilling Solutions Portfolio in Asia Pacific
With global smartphone sales expected to grow by only seven percent in 2016 (Gartner), component manufacturers are under increasing market pressure to deliver advanced technology on smaller form factors, at reduced production costs. The placement of nViant™ systems demonstrates the Asian electronics manufacturing community's increasing acceptance of the superior manufacturing capabilities and greater flexibility that laser-based tools deliver.
"We are beginning to gain traction in the HDI and substrate manufacturing segments," said Dr.
Demand in the smartphone and IoT markets is driving the need for miniaturization, while maintaining or increasing device functionality, all at the lowest possible cost. In order to take advantage of such trends, manufacturers are increasingly utilizing laser-based machining to either reduce the size of -- or increase the density of -- relevant features such as HDI microvias. The nViant™ system possesses the accuracy and throughput required to meet these new market needs, while doing so at the lowest possible cost of ownership as compared to other like equipment. As orders for emerging technologies increase, manufacturers with laser-based micromachining capabilities will be better equipped to address complex engineering and design specifications dictated by such product requirements as being bendable, stretchable, and reliable and accommodating a higher level of component density. A system like nViant™ is necessary to deliver circuitry that works within these evolving constraints, while also serving the immediate PCB and substrate processing requirements for today.
"nViant™ helps customers optimize their manufacturing capabilities to create interconnected solutions and deliver the next generation of circuitry," said
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Media Contacts: ESI Kate Blatner 503-526-5063 email@example.com ESI Brian Smith 503-672-5760 firstname.lastname@example.org
News Provided by Acquire Media